G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Revision:SEMI G77-0699 (Reapproved 0215) - Superseded This Guide defines standard terminologies

This Guide defines standard terminologies for all the features of leadframes used in the production of semiconductor circuits

This Standard was technically approved by the HB-LED Global Technical Committee

SEMI MF1049-0308 (Reapproved 1123)

SEMI M53-1103 (technical revision)

blend technique classification(s)

G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Revision:SEMI G77-0699 (Reapproved 0215) - Superseded This Guide defines standard terminologies1 Purpose 1. 1 This Standard specifies the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die bonding process. 2 Scope 2. 1 This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. 2. 2 Only the physical interfaces for the frame cassette are specified; no materials