G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Revision:SEMI G87-1108 (Reapproved 0215) - Superseded 4-1022 (first published)

4-1022 (first published)

Bow and warp are measures of the distortion of the median surface of the wafer

1-0226 — Specification for SECS-II Protocol for Control Job Management (CJM)

Current edition approved by the Japanese Regional Standards Committee on June 1

0% min and Ethyl benzene 1% max

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Revision:SEMI G87-1108 (Reapproved 0215) - Superseded 4-1022 (first published)The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used