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Both the active and passive equipment manage this operation
3-1016 (technical revision)
In conjunction with a SEMI SAN common device model (CDM) specification and one or more SEMI specific device model (SDM) specifications (e
Some of these compounds are volatile and others can become airborne through chemical reactions
automation and metrology systems used in the Front-End and Back-End production area
M04300 - SEMI M43 - Guide for Reporting Wafer Nanotopography Revision:SEMI M43-1109 - Superseded Both the active and passiveThis Guide provides a framework for reporting of nanotopography surface features on silicon wafers. This Guide addresses reporting the characterization of nanotopography surface features found on wafer surfaces. Nanotopography is the non planar deviation of the whole front wafer surface within a spatial wavelength range of approximately 0. 2 to 20 mm and within the fixed quality area (FQA). Typical examples include dips, bumps or waves on the wafer